现任材料加工系党支部书记、电子封装技术专业责任教授、国防科技工业元器件封装技术创新中心专家委员会委员，先后获得北京市本科毕业论文优秀指导教师、北京理工大学优秀共产党员、三育人先进个人、优秀班主任等荣誉称号。主讲《电子制造工程导论》、《微连接原理》、《电子封装工艺》、《焊接工程基础》等本科生课程。先后主持并参与完成了科工局基础科研、国家科技支撑、总装预研、总装预研基金及航天创新基金等数十项科研工作，在国内外学术期刊发表SCI和EI论文百余篇，获批国家发明专利十余项，并获得中国产学研合作创新成果二等奖。

1.电子封装互连材料研究；
2.先进电子封装工艺与可靠性研究；
3.微纳材料制备及应用研究；
4.新型合金制备及性能研究。

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[10]电子软钎焊连接技术，译著，北京理工大学出版社，2021